Pad for integrated circuit device which allows for multiple probing and reliable bonding and integrated circuit device including the pad
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United States of America Patent
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-
Feb 26, 2002
Grant Date -
N/A
app pub date -
Jun 15, 2000
filing date -
Sep 16, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit device having a first type of pads with a probing portion and a bonding portion. The integrated circuit device includes a memory cell array, a logic circuit, and a plurality of the first type of pads and a plurality of a second type of pads. The second type of pads are electrically connected to the logic circuit. The first type of pads are electrically connected to the memory cell array and the logic circuit. Only the probing portion of the first type of pads is contacted by probes during testing of the memory cell array, and the bonding portion is used exclusively for attachment of a bond wire to permit connection to an external system.
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