Method to install an electronic component and its electrical connections on a support, and product obtained thereby
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United States of America Patent
Stats
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Mar 20, 1990
Grant Date -
N/A
app pub date -
Dec 12, 1988
filing date -
Dec 14, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.
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