Surface-acoustic-wave device having an improved pass-band characteristic and an improved degree of freedom for setting input and output impedances

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United States of America Patent

PATENT NO 6271739
SERIAL NO

09363751

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A surface acoustic wave device supported by a package body. At least one surface acoustic wave element having interdigital electrodes disposed on a propagation path of a surface acoustic wave on the piezoelectric substrate. These interdigital electrodes include an input-side interdigital electrode connected to a ground pad on the package body and an output-side interdigital electrode connected to another ground pad on the package body.

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Patent Owner(s)

  • TAIYO YUDEN CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Endoh, Gou Kawasaki, JP 8 133
Fujiwara, Yoshiro Kawasaki, JP 20 391
Kawachi, Osamu Kawasaki, JP 60 662
Ueda, Masanori Kawasaki, JP 165 2670

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