Wiring substrate and process for producing the same
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United States of America Patent
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Nov 5, 2002
Grant Date -
Aug 2, 2001
app pub date -
Dec 8, 2000
filing date -
Jan 27, 2000
priority date (Note) -
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Abstract
Signal wirings 22, 23 are formed on a pair of substrates 20, 21, and the substrates are joined together through an insulating layer 24 so that the signal wirings 22, 23 are placed in parallel and facing to each other. The surfaces of the overlapping faces of the signal wirings 22, 23 are made smooth, and the roughness of the same surfaces is smaller than the skin depth .delta..sub.s due to the skin effect, preferably less than one third, for minimizing the increase in the electric resistance due to the skin effect.
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