Electrical connector wafer with V-grooves
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United States of America Patent
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May 6, 2003
Issued Date -
N/A
app pub date -
Jun 24, 1998
filing date -
Sep 29, 1995
priority date (Note) -
Expired
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Abstract
An electrical plug has a multiplicity of contact terminals disposed on a wafer that is received within a housing. The wafer or substratum is grooved or channeled between each contact terminal. In this manner, the contacting surface of each terminal is essentially raised from the surface of the substratum. Generally, the groove takes the form of a modified V shape, however, other groove configurations may be utilized. By lowering the substratum surface during formation of the wafer, the contact surface of each terminal becomes elevated from the substratum surface, while remaining at the same height relative to each other. Any misregistration or misalignment of the terminals of the receptacle caused by tilting, twisting or otherwise that would cause an open circuit or poor contact is alleviated by the channel. The misaligned receptacle terminal is allowed to tilt and be received into the channel rather than contacting the substratum surface to be held away from contact.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- FCI AMERICAS TECHNOLOGY, INC.;BERG TECHNOLOGY, IND.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hahn, Marlyn E | York, PA | 12 | 189 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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