Wafer reconstitution and die-stitching

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United States of America Patent

PATENT NO 11158607
APP PUB NO 20200176419A1
SERIAL NO

16503806

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Abstract

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Stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. In an embodiment, a chip includes a reconstituted chip-level back end of the line (BEOL) build-up structure to connect a die set embedded in an inorganic gap fill material.

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Patent Owner(s)

Patent OwnerAddress
APPLE INCONE APPLE PARK WAY CUPERTINO CA 95014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dabral, Sanjay Cupertino, US 154 2035
Hu, Kunzhong Cupertino, US 73 863
Lai, Kwan-Yu Campbell, US 29 707
Ramachandran, Vidhya Cupertino, US 65 806
Zhai, Jun Cupertino, US 129 1238

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