Cooling apparatus for memory module
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United States of America Patent
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Apr 27, 2010
Grant Date -
Jul 26, 2007
app pub date -
Sep 27, 2006
filing date -
Jan 25, 2006
priority date (Note) -
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Abstract
A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.
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