Bump structure of semiconductor package and method for fabricating the same
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United States of America Patent
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Sep 18, 2007
Grant Date -
Mar 9, 2006
app pub date -
Dec 29, 2004
filing date -
Sep 7, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A bump structure of a semiconductor package and a method for fabricating the same are provided. The bump structure is used to connect a semiconductor element to a carrier of the semiconductor package. The fabrication method primarily employs an electroplating process to form the bump structure including an under bump metallurgy (UBM) layer, at least one I-shaped conductive pillar, and a solder material. This allows fine-pitch electrical connection pads to be arranged in the semiconductor package, and also provides an enhanced support structure and a sufficient height between the semiconductor element and the carrier.
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