Suppressing lithography at a wafer edge

United States of America Patent

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Nov 1, 2005
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Sep 2, 2004
app pub date
Feb 28, 2003
filing date
Feb 28, 2003

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Expired

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Abstract

Damage to the rim of a semiconductor wafer caused by etching processes is reduced by forming a rim of carbonized photoresist around the outer edge of the wafer, using a wafer edge tool to carbonize the outer rim of a positive tone photoresist.

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INTERNATIONAL BUSINESS MACHINES CORPORATION;QIMONDA AG

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Chen, Linda A	Hopewell Junction, NY	2	5
Li, Wai-Kin	Poughkeepsie, NY	150	2103

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Suppressing lithography at a wafer edge

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10248911

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PATENT NO	6960532
APP PUB NO	20040171267A1
SERIAL NO	10248911
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 01, 2005	US,6960532,B2 US6960532B2	GRANTED PATENT AS SECOND PUBLICATION
September 02, 2004	US,20040171267,A1 US20040171267A1	FIRST PUBLISHED PATENT APPLICATION

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