Apparatus and method for reclamation of used polishing slurry
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United States of America Patent
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May 6, 2003
Grant Date -
N/A
app pub date -
Sep 19, 2000
filing date -
Sep 19, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a polishing slurry reclamation system. In one embodiment, the polishing slurry reclamation system comprises a polishing apparatus having a polishing platen and a fluid delivery system positioned to deliver a slurry or a rinse to the polishing platen, a recovery drain adjacent the polishing platen, and a fluid diverter associated with the platen and configured to deflect a selected one of a slurry or rinse emanating from the polishing platen to the recovery drain.
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