Integrated circuit package system with interlock
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United States of America Patent
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May 3, 2011
Grant Date -
Mar 6, 2008
app pub date -
Aug 23, 2006
filing date -
Aug 23, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An integrated circuit package system is provided including forming a first external interconnect and a die paddle having a slot, forming an inner terminal from a peripheral region of the die paddle, connecting an integrated circuit die and the peripheral region for ground connection, and molding through the slot.
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