Die apparatus and method for high temperature forming of metal products
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United States of America Patent
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Oct 14, 2008
Grant Date -
Oct 2, 2008
app pub date -
Aug 18, 2005
filing date -
Aug 18, 2005
priority date (Note) -
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Abstract
A bi-material die apparatus for high temperature forming of metal parts has at least two opposing die segments having inner surfaces together forming a hollow mold chamber for receiving a mold blank between the die segments. The die segments are of a first material having a first coefficient of thermal expansion CTE.sub.1. At least one insert of a second material is associated with the inner surface of at least one of the die segments so as to project into the mold chamber, the second material having a second coefficient of thermal expansion CTE.sub.2 higher than CTE.sub.1 and higher than the coefficient of thermal expansion of the metal product to be formed in the cavity.
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