Wound body of sheet for sintering bonding with base material
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United States of America Patent
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Jul 11, 2023
Grant Date -
Sep 17, 2020
app pub date -
Mar 13, 2020
filing date -
Mar 15, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.
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