Surface acoustic wave device

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United States of America Patent

PATENT NO 7141909
SERIAL NO

10834596

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Abstract

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A surface acoustic wave device includes a piezoelectric substrate and interdigital electrodes disposed on the piezoelectric substrate, wherein each of the interdigital electrodes includes a main electrode layer made of Cu or an alloy that has Cu as its main component. The surface acoustic wave device also includes a tightly adhering layer which is disposed between the main electrode layer and the piezoelectric substrate and whose main component is NiCr, or a tightly adhering layer whose main component is Ti and whose film thickness is within a range of about 18 nm to about 60 nm.

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Patent Owner(s)

  • MURATA MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hada, Takuo Nagaokakyo, JP 17 134
Kadota, Michio Kyoto, JP 195 6277
Nakagawara, Osamu Rittou, JP 11 3807
Nakao, Takeshi Nagaokakyo, JP 99 1438

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