Stud bump for wirebonding high voltage isolation barrier connection

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11973052
APP PUB NO 20220352111A1
SERIAL NO

17242380

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic device includes a bond wire with a first end bonded by a ball bond to a planar side of a first conductive plate, and a second end bonded by a stitch bond to a conductive stud bump at an angle greater than or equal to 60 degrees. A wirebonding method includes bonding the first end of the conductive bond wire to the first conductive plate includes forming a ball bond to join the first end of the conductive bond wire to a planar side of the first conductive plate by a ball bond, and bonding the second end of the conductive bond wire to the conductive stud bump includes forming a stitch bond to join the second end of the conductive bond wire to the conductive stud bump.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Hung-Yu Taipei, TW 18 32
Huang, Sheng-Wen Taipei, TW 83 165
Li, Chien-Chang New Taipei, TW 45 545
Williams, Byron Lovell Plano, US 53 224
Zhan, Zi-Xian New Taipei, TW 2 0

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