Semiconductor package with heat dissipating structure and method of manufacturing the same
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United States of America Patent
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Apr 10, 2007
Grant Date -
Oct 13, 2005
app pub date -
Jan 28, 2005
filing date -
Jan 28, 2004
priority date (Note) -
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Abstract
A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected with the substrate by bonding means, a heat slug which is adhered to the semiconductor chip and formed of a thermally conductive material, and a heat spreader partially exposed to the outside of the semiconductor package, and which is formed on the heat slug to be spaced a buffer gap apart from the heat slug.
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