Methods for producing lead-free in-situ composite solder alloys
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United States of America Patent
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Aug 10, 2010
Grant Date -
Jun 17, 2004
app pub date -
Dec 8, 2003
filing date -
Jul 13, 1998
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Abstract
Methods are disclosed for producing in-situ composite solders having a particulate intermetallic phase homogeneously distributed throughout the solder matrix. An eutectic solder is mixed with the components of the intermetallic phase, melted and rapidly cooled to form the desired solder. In-situ composite solder alloys formed by the disclosed method provide greater solder joint strength and fatigue resistance.
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