Method and apparatus for cooling electronic components
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United States of America Patent
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-
Mar 14, 2006
Grant Date -
Nov 10, 2005
app pub date -
May 4, 2004
filing date -
May 4, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with a cold plate return manifold, a cold plate supply manifold, and an end-user fluid supply. A method for cooling electronic components in a rack, the method comprising: circulating a first liquid from a cold plate to one of a plurality of heat exchangers mounted within the rack; circulating a second liquid from a second liquid supply to the one of a plurality of heat exchangers; and transferring heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.
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