Semiconductor device and method of manufacturing the same
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United States of America Patent
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Jul 20, 2010
Grant Date -
Oct 25, 2007
app pub date -
Jun 13, 2007
filing date -
Jul 25, 2001
priority date (Note) -
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Abstract
There are included a semiconductor substrate provided with a desirable element region, an electrode pad formed to come in contact with a surface of the semiconductor substrate or a wiring layer provided on the surface of the semiconductor substrate, a bonding pad formed on a surface of the electrode pad through an intermediate layer, and a resin insulating film for covering a peripheral edge of the bonding pad such that an interface of the bonding pad and the intermediate layer is not exposed to a side wall.
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