Method of making an article comprising solder bump bonding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 3, 1994
Grant Date -
N/A
app pub date -
Apr 27, 1993
filing date -
Apr 27, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention is embodied in a technique for precise and accurate height control in fabricating solder bumps or joints formed from a solder bump or bumps. A solder bump is formed by reflow of a conical solder body having base diameter D, height H and cone angle .theta., and has truncated sphere shape, with height h and truncation diameter d. We have found that D, H, and d can be selected such that .differential.h/.differential.H is small (typically .ltoreq.0.5), indicative of relative insensitivity of the bump height to variation in the height of the conical solder body. The inventive process is also applicable to a component (e.g., a laser) solder-bonded to a substrate, and can provide previously unattainable control of the spacing between component and substrate.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully