Multi-chip package
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United States of America Patent
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May 3, 2011
Grant Date -
Jul 9, 2009
app pub date -
Dec 10, 2008
filing date -
Dec 13, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed by a chemical vapor deposition method between a lead frame or a heat sink and the semiconductor chips disposed thereon.
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