Integrated fuse for multilayered structure
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United States of America Patent
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Sep 20, 2005
Grant Date -
Jul 7, 2005
app pub date -
Jan 5, 2004
filing date -
Jan 5, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A device includes a substrate and a first layer disposed adjacent the substrate. A second layer is disposed adjacent the first layer. A third layer contains a gap and is disposed adjacent the second layer. A fuse is electrically coupled to the third layer and is located in the proximity of the gap in the third layer.
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