Method and apparatus for broadband electromagnetic modeling of three-dimensional interconnects embedded in multilayered substrates
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United States of America Patent
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Nov 13, 2012
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app pub date -
Apr 14, 2009
filing date -
Dec 8, 2008
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Expired
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Abstract
Systems and methods for modeling a multilayer integrated circuit include three-dimensional interconnect models in multilayered substrates for greater accuracy. Mesh models are used to resolve effects of nearby elements and grid models are used to resolve effects of far-away elements. Sidewall mesh elements of three-dimensional interconnects are projected onto parallel (or substantially parallel) grids between the top and bottom walls of the interconnects so that grid models can be used to resolve three-dimensional effects of interconnects in multilayered substrates.
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