Microfluidic delivery system with a die on a rigid substrate

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United States of America Patent

PATENT NO 11523500
APP PUB NO 20190200453A1
SERIAL NO

16287949

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Abstract

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The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

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Patent Owner(s)

  • STMICROELECTRONICS INTERNATIONAL N.V.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bush, Steve Liberty Township, US 15 491
Dodd, Simon West Linn, US 65 515
Hunt, Dave San Diego, US 18 163
Scheffelin, Joe San Diego, US 12 62
Sherman, Faiz Mason, US 12 41

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