Apparatus for spraying etchant solution onto preformed printed circuit board
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United States of America Patent
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-
Jul 20, 2010
Grant Date -
Feb 7, 2008
app pub date -
Dec 14, 2006
filing date -
Jul 28, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.
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