Chip carrier device and method for the production of a chip carrier device with an electrical test
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United States of America Patent
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Nov 4, 2003
Grant Date -
N/A
app pub date -
Apr 2, 2001
filing date -
Jul 15, 1998
priority date (Note) -
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Abstract
A chip carrier arrangement (10) for an encased chip arrangement has a chip carrier (11), whose one chip contact side (24) exhibits a conductor path structure (12) with a terminal face (17) extending to an outer contact side (25) of the chip carrier and allocated to at least one chip (18) with a through connection (14). The chip carrier (11) has additional through connections (14) connected with the conductor path structure (12), which are used for contacting with test connections (32) of a test board (29, 30).
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