Padless high density circuit board
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United States of America Patent
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Mar 8, 2005
Grant Date -
Sep 2, 2004
app pub date -
Feb 28, 2003
filing date -
Feb 28, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A padless high density circuit board and manufacturing method thereof. The method includes providing a circuit board substrate, forming external wiring, having a plurality of external terminals with a width as large as or less than the external wiring on the circuit board substrate, forming a solder mask over the circuit board substrate and the external wiring with a plurality of solder mask openings exposing the external terminals, with diameters at least as large as the widths of the external terminals exposed thereby, and forming a plurality of conductive bumps on the external terminals exposed by the solder mask openings for connection with an external device in a subsequent assembly process.
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