Conductive element metallized with a thick film gold composition
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United States of America Patent
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-
Oct 15, 1985
Issued Date -
N/A
app pub date -
Apr 27, 1984
filing date -
Nov 19, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.
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