Importance

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Abstract

A multi-chip module is proposed, which is designed to pack two or more semiconductor chips in a stacked manner over a chip carrier in a single package. The proposed multi-chip module is characterized by the use of a reverse wire-bonding technique to allow the topmost bent portions of a first set of bonding wires connected to the bottommost chip to be positioned above the substrate rather than above the bottommost chip. Then, an adhesive layer is formed to a thickness that allows it to entirely wrap the part of the bonding wires that is positioned above the active surface of the bottommost chip to prevent the bonding wires connected to the bottommost chip to come in contact with at least one overlaid chip. This allows the prevention of voids between the two stacked chips in the encapsulation body. Moreover, the proposed multi-chip module allows the stacked chips to be variably-sized according actual needs without the problem of the bonding wires being damaged during the mounting of the overlaid chip. The overlaid chip is electrically connected to the substrate by a second set of bonding wires, and an encapsulation body is provided to encapsulate the first semiconductor chip, the first set of bonding wires, the second semiconductor chip, and the second set of bonding wires.

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First Claim