Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11751387
APP PUB NO 20220278122A1
SERIAL NO

17749105

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Abstract

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A semiconductor device having a three-dimensional (3D) structure is disclosed. The semiconductor device includes a first chip configured to include a peripheral circuit, and a second chip stacked on the first chip that is configured to include a first memory cell array and a second memory cell array. A plurality of transfer circuits are configured to connect a plurality of row lines of the first memory cell array and a plurality of row lines of the second memory cell array to respective global row lines is divided between the first chip and the second chip.

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Patent Owner(s)

  • SK HYNIX INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Go Hyun Icheon-si, KR 14 47

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