Oxide liner stress buffer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11659660
APP PUB NO 20210136915A1
SERIAL NO

16671468

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A through-wafer via substrate includes a substrate having an intermediate layer and a bonding layer formed on a surface of the intermediate layer. A via cavity extends through the bonding layer and into the intermediate layer, and a stress buffer liner is deposited directly on inner sidewalls and a base of the via cavity. An electrically conductive through-wafer via is disposed in the via cavity such that the stress buffer liner is interposed completely between the intermediate layer and the through-wafer via.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • RAYTHEON COMPANY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clarke, Andrew Santa Barbara, US 61 608
Drab, John J Santa Barbara, US 37 366
Frandsen, Christine Santa Barbara, US 4 80

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Nov 23, 2026
7.5 Year Payment $3600.00 $1800.00 $900.00 Nov 23, 2030
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 23, 2034
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00