Semiconductor device and method for fabricating the same
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United States of America Patent
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Dec 26, 2006
Issued Date -
N/A
app pub date -
Jan 18, 2005
filing date -
Dec 14, 2000
priority date (Note) -
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Abstract
A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
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