Force balanced package mounting

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11330738
SERIAL NO

17133525

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Importance

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Abstract

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An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.

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Patent Owner(s)

  • XILINX INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aue, Volker Dresden, DE 46 446
Chao, Chi-Yi New Taipei, TW 3 0
Ramalingam, Suresh Fremont, US 67 661
Refai-Ahmed, Gamal Santa Clara, US 77 883
Wang, Huayan Campbell, US 24 341

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