Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process

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United States of America Patent

PATENT NO 11152363
APP PUB NO 20190304977A1
SERIAL NO

16368210

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Abstract

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The present disclosure relates to a bulk complementary-metal-oxide-semiconductor (CMOS) device including a device substrate, a thinned device die with a device region over the device substrate, a first mold compound, and a second mold compound. The device region includes a back-end-of-line (BEOL) portion and a front-end-of-line (FEOL) portion over the BEOL portion. The first mold compound resides over the device substrate, surrounds the thinned device die, and extends vertically beyond the thinned device die to define an opening over the thinned device die and within the first mold compound. The second mold compound fills the opening and directly connects the thinned device die. Herein, a silicon material with a resistivity between 5 Ohm-cm and 30000 Ohm-cm does not exist between the second mold compound and the thinned device die.

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Patent Owner(s)

  • QORVO US, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carroll, Michael Jamestown, US 68 2872
Costa, Julio C Oak Ridge, US 98 6812
Leipold, Dirk Robert Walter San Jose, US 171 4040
Maxim, George Saratoga, US 176 3931
Scott, Baker San Jose, US 183 4348

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