Positive resist composition for immersion exposure and method of pattern formation with the same
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United States of America Patent
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Sep 25, 2007
Grant Date -
Aug 25, 2005
app pub date -
Feb 18, 2005
filing date -
Feb 20, 2004
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Abstract
A positive resist composition for immersion exposure which comprises (A) a resin which enhances its solubility in an alkaline developer by the action of an acid and (B) at least one compound which generates an acid upon irradiation with an actinic ray or a radiation, the compound being selected from the following (Ba) to (Bc): (Ba) a sulfonium salt compound having a specific alkyl or cycloalkyl residue in the cation part, (Bb) a sulfonium salt compound having a specific alkyl or cycloalkyl residue in the cation part, and (Bc) a sulfonium salt compound having a specific alkyl or cycloalkyl residue in the anion part; and a method of pattern formation with the composition.
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