Rigid flexible printed circuit board and method of manufacturing the same
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United States of America Patent
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Dec 13, 2016
Grant Date -
Nov 27, 2014
app pub date -
May 20, 2014
filing date -
May 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
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