Package and package assembly of power device
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United States of America Patent
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Dec 7, 2010
Issued Date -
N/A
app pub date -
Feb 28, 2007
filing date -
Mar 3, 2006
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A package and a package assembly for a power device having a high operation voltage and impulse voltage are provided. The package assembly for a power device comprises an assembly wherein the power device is encapsulated and electrically connected to a lead protruding outside the package, and an isolation spacer filling a clearance distance between the package and a heat sink attached to the package.
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