METHOD OF AND APPARATUS FOR PROTECTING THIN COPPER FOIL AND OTHER SHINY SUBSTRATES DURING HANDLING AND RIGOROUS PROCESSING, AS PCB MANUFACTURE AND THE LIKE, BY ELECTRIC-CHARGE ADHERENCE THERETO OF THIN RELEASE-LAYERED PLASTIC FILMS AND THE LIKE, AND IMPROVED PRODUCTS PRODUCED THEREBY
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United States of America Patent
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Jul 26, 2005
Grant Date -
Jan 1, 2004
app pub date -
Jun 28, 2002
filing date -
Jun 28, 2002
priority date (Note) -
Expired
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Abstract
An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.
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