Structure of package
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United States of America Patent
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Aug 21, 2007
Grant Date -
Nov 3, 2005
app pub date -
Apr 30, 2004
filing date -
Apr 30, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention discloses a structure of wafer level packaging. The structure comprises a first patterned isolation layer, a conductive layer and a second patterned isolation layer. The first patterned isolation layer is formed with a passivation layer of an IC (Integrated Circuit). The conductive layer is configured to have a curved or winding conductive pattern. The second patterned isolation layer is formed over the conductive layer to have a plurality of openings, and contact metal balls can be formed on the openings to electrically couple to a print circuit board.
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