Printed circuit board homogenization treatment device
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United States of America Patent
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Jan 30, 2024
Grant Date -
N/A
app pub date -
Sep 25, 2020
filing date -
Jul 2, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board homogenization treatment device includes a load mechanism, a position mechanism and a drive mechanism. The load mechanism is disk-shaped and configured to fix the printed circuit board; the position mechanism at least includes a first position wheel and a second position wheel that can jointly support the load mechanism; the position mechanism is switchable between a first state and a second state; when the position mechanism is in the first state, the load mechanism and the drive mechanism are spaced apart; when the position mechanism is in the second state, the drive mechanism is configured to drive the load mechanism to rotate around its central axis; both the first position wheel and the second position wheel are configured to rotate with rotation of the load mechanism.
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