Silicone pads for electronics thermal management
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United States of America Patent
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Oct 10, 2006
Grant Date -
Sep 8, 2005
app pub date -
Mar 4, 2004
filing date -
Mar 4, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of choosing a formulation for a carrier free pad having desired thermal conductivity and elastomeric properties therein which will produce a pad having a desirable thermal impedance. A combination of a vinyl functional fluid, hydrogen capped polysiloxane, cross linker and powder in the form of heat conductive particles with or without electrically insulating particles is utilized which is variable according to the desired thickness, elastomeric and thermal characteristics of the pad. Inhibitors and catalysts may be utilized to control reaction rate. The formulation enables one to more efficiently arrive at a final formulation for a thermal pad having the desired performance characteristics according to the job at hand.
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