Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 9, 1992
Issued Date -
N/A
app pub date -
Jan 4, 1991
filing date -
May 5, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering one side of the foil with a sheet of polyethylene film. The film is removably joined with the foil by an adhesive material placed between the film and the foil in a marginal area of the latter. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully