Micromechanical component and appropriate manufacturing method
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United States of America Patent
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May 28, 2002
Grant Date -
Jan 17, 2002
app pub date -
May 16, 2001
filing date -
May 17, 2000
priority date (Note) -
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Abstract
A micromechanical component, particularly a pressure sensor, includes a substrate, made of semiconductor material; a functional layer provided epitactically on substrate; a hollow space being provided between substrate and functional layer defining a diaphragm region of functional layer; and below diaphragm region, on substrate, one or more spacers being provided, for preventing adhesion of diaphragm region to substrate during deformation. Also described is an appropriate manufacturing method.
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