Method for manufacturing semiconductor package substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 15, 2008
Grant Date -
Apr 19, 2007
app pub date -
Sep 18, 2006
filing date -
Oct 17, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads distributed on the periphery of the free area. A metal protecting layer is plated on the electrically connecting pads by non-plating line. The free area is removed, to form a cavity penetrating the circuit board. The present invention prevents burrs which may otherwise form on the periphery of a cavity, to increase the yield and throughput.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully