Integrated wafer transfer mechanism

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7976263
APP PUB NO 20090082895A1
SERIAL NO

11859752

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.

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Patent Owner(s)

  • DYNAMIC MICRO SYSTEM

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barker, David Walnut Creek, US 88 1784
LoBianco, Robert T Sunnyvale, US 11 151
Mantripragada, Sai Fremont, US 15 558
Tabrizi, Farzad Reno, US 7 624

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