Apparatus and methods for collecting global data during a reticle inspection
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United States of America Patent
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Feb 4, 2003
Grant Date -
N/A
app pub date -
May 3, 1999
filing date -
May 3, 1999
priority date (Note) -
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Abstract
Disclosed is a method of inspecting a reticle defining a circuit layer pattern that is used within a corresponding semiconductor process to generate corresponding patterns on a semiconductor wafer. A test image of the reticle is provided, and the test image has a plurality of test characteristic values. A baseline image containing an expected pattern of the test image is also provided. The baseline image has a plurality of baseline characteristic values that correspond to the test characteristic values. The test characteristic values are compared to the baseline characteristic values such that a plurality of difference values are calculated for each pair of test and baseline characteristic values. Statistical information is also collected.
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