Heat exchange assembly
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United States of America Patent
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Jan 2, 2024
Grant Date -
Mar 30, 2023
app pub date -
Sep 15, 2021
filing date -
Sep 15, 2021
priority date (Note) -
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Abstract
A heat exchange assembly includes a plate stack having fin plates and spacer plates interleaved with the fin plates in the plate stack. Each fin plate has fin sides extending between a fin lower edge and a fin upper edge. Each spacer plate has spacer sides extending between a spacer lower edge and a spacer upper edge. The fin upper edges of the fin plates are located above the spacer upper edges. Air flow channels are formed in gaps between the fin plates above the spacer plates. The fin lower edges and the spacer lower edges define a lower thermal interface configured to be in thermal communication with an electrical component to dissipate heat from the electrical component. The fin plates are independently movable relative to the spacer plates in the plate stack to independently articulate the fin lower edges and the spacer lower edges at the lower thermal interface. The heat exchange assembly includes a plate stabilizer structure positioning the fin upper edges relative to each other. The plate stabilizer structure includes plate stabilizers having stabilizing fingers. The stabilizing fingers coupled to at least two fin plates to control spacing of the fin upper edges of the corresponding fin plates.
First Claim
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TE CONNECTIVITY SOLUTIONS GMBH | MUEHLENSTRASSE 26 SCHAFFHAUSEN 8200 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Sharf, Alex Michael | Harrisburg, US | 57 | 1097 |
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