Semiconductor device having a plurality of pads of low diffusible material formed in a substrate

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United States of America Patent

PATENT NO 8742585
SERIAL NO

13758775

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Abstract

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A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

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Patent Owner(s)

  • SONY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okuyama, Atsushi Kanagawa, JP 98 1050

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