Circuit board with heat dissipation structure and method for manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11979977
APP PUB NO 20230112890A1
SERIAL NO

16978842

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

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Patent Owner(s)

  • QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; AVARY HOLDING (SHENZHEN) CO., LIMITED.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Ming-Jaan New Taipei, TW 84 79
Hsu, Hsiao-Ting New Taipei, TW 31 8
Hu, Xian-Qin Shenzhen, CN 51 58
Liao, Tao-Ming Tayuan, TW 5 12
Shen, Fu-Yun Shenzhen, CN 48 47

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