Copper interconnect
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United States of America Patent
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Aug 4, 2009
Grant Date -
Mar 16, 2006
app pub date -
Nov 4, 2005
filing date -
Jun 14, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the semiconductor device comprises a layer of copper and at least one layer of metal and/or at least a barrier layer of material between the copper layer and one layer of metal on the copper layer to form a bond pad.
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